Unit 2 Gable Business Park, 10 Derrick Drive, Somerset West, 7130
XT V 160 NF thumb
XT V 160 NF thumb
XT V 160 NF thumb

XT V 160 NF Nanofocus X-ray inspection

XT V 160 NF is a high-precision, flat-panel based X-ray inspection system that facilitates real-time imaging and defect analysis of next-generation wafer-level, semiconductor device and PCBA applications. Equipped with an in-house designed X-ray NanoFocus source and high precision manipulator, this industry-leading inspection system offers unrivalled feature recognition compared to any product available on the market today. As such, the XT V 160 NF is indispensable for any electronics development and production environment.

Key benefits

XT V 160 NF Key features

The ultimate NanoFocus X-ray system For Next-generation wafer, semiconductor & PCBA inspection

3D analysis
The 3D analysis option on the XT V 160 NF is based on laminography reconstruction techniques, providing sub-micron defect recognition. It provides a method of inspecting a region of interest which can be challenging to inspect with 2D radiography, such as 3D stack dies or BGA pad cracks. From the 3D model it is possible to view any plane of a sample from any direction without the need to isolate or cut the interest area.

The continued demand for high performance electronics is driving packaging technology towards tighter density, higher IO capabilities and most importantly reduced footprint.
Modern X-ray inspection systems must provide the highest magnification, sharpest imaging and uncompromised accuracy.
•Through Silicon Via (TSV) filling and voids
•Cu-Pillar, micro-bump cold joint detection and void analysis
•BGA voids, size measurements, cold joint and head-in-pillow detection
•Ultra-fine pitch bond wire analysis: ball bond, broken wire, wire sweep, stitch bond
•QFN/QFP inspection including automated pad void array analysis
•3D stack die and Pack-on-Package (POP)
•MEMS applications with narrow density variations
•Complete automated wafer inspection for micro-bump metrology

XT V 160 NF Specifications

Specifications XT V 160 NF

kV range 30-160 kV
Max. beam current 600 μA
Max. tube power 20 W
Min. feature recognition  
Geometric magnification up to 2,400x
Detector 3Mpixel (1,944 x 1,536 pixels)
75 μm pixel size
26 fps update rate
Max. inspection area 510 × 510 mm
Max. board size 580 × 580 mm
Max. tilt angle 60°
Cabinet size W: 1,819 mm (excl. operator console)
H: 1,998 mm
D: 1,728 mm
Vibration isolation Anti-vibration mounts (standard)
Monitor Single 30” or dual 22” display
X-ray safety 1 μSv/hr (to IRR 99)


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